PakCat catalogue record Chip on board technologies for multichip modules ND By edited by John H. Lau Bibliographic details ISBN0442014414 PublisherVan Nostrand Reinhold Publication placeNew York Publication year1994 EditionND LanguageEnglish Material typeBook Physical descriptionxviii, 555 p. Additional authorsLau, John H. SubjectsElectronic packaging., Surface mount technology.