PakCat catalogue record

FLIP CHIP TECHNOLOGIES

By LAU, JOHN H.

Bibliographic details

Publisher
NEW YORK, USA
Publication place
MCGRAW HILL
Publication year
1995
Material type
Book
Physical description
565

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Microvias for Low Cost, High Density Interconnects Lau, John H. Flip Chip technologies Lau, JOhn H. FLIP CHIP TECHNOLOGIES LAU, JOHN H.